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datashee t product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/38 tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 tsz22111 ? 14 ? 001 www.rohm.com single-output ldo regulators 35v withstand voltage 1a ldo regulators bdxxfc0 series description the bdxxfc0 series are low-saturation regulators. the series? output voltages are variable, 3.0v, 3.3v, 5.0v, 6.0v, 7.0v, 8.0v, 9.0v, 10.0v, 12.0v and 15.0v and packages are htsop-j8, to252-3, and to252-5. this series has a built-in over-current protecti on circuit that prevents the destruction of the ic due to output short circuits and a thermal shutdown circuit that protects the ic from thermal damage due to overloading. key specifications 1) output current capability: 1a 2) output voltage: variable, 3.0v, 3.3v, 5.0v, 6.0v, 7.0v, 8.0v, 9.0v, 10.0v, 12.0v and 15.0v 3) high output voltage accuracy (ta=25 ): 1% 4) low saturation with pdmos output 5) built-in over-current protec tion circuit that prevents the destruction of the ic due to output short circuits 6) built-in thermal shutdown circuit for protecting the ic from thermal damage due to overloading 7) available ceramic capacitor to prevent oscillation 8) htsop-j8, to252-3 and to252-5 packages features ? output voltage: 1.0v to 15.0v ? output voltage precision(ta=25 ): 1% ? supply voltage(v o R 3.0v): v o +1.0v to 26.5v ? supply voltage(v o 3.0v): 4.0v to 26.5v ? output current: 1a ? operating temperat ure range: -25 Q ta Q +85 packages (typ) (typ) (max) htsop-j8 4.90mm x 6.00mm x 1.00mm to252-3 6.50mm x 9.50mm x 2.50mm to252-5 6.50mm x 9.50mm x 2.50mm ordering part number b d x x f c 0 w x x x - e 2 part number output voltage 00: variable 30: 3.0v 33: 3.3v 50: 5.0v 60: 6.0v 70: 7.0v 80: 8.0v 90: 9.0v j0: 10.0v j2: 12.0v j5: 15.0v input voltage f:35v output current c0:1.0a shutdown mode ?w?: included shutdown mode none: without shutdown mode package efj: htsop-j8 fp: to252-3/5 packaging and forming specification e2: emboss tape reel
datasheet d a t a s h e e t 2/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 lineup articles variable 3.0 3.3 5.0 6.0 7.0 8.0 9.0 10.0 12.0 15.0 ??` bdxxfc0wefj-e2 htsop-j8 reel of 2500 bdxxfc0fp-e2 - - - - - - - - - to252-3 reel of 2000 bdxxfc0wfp-e2 (note 1) to252-5 reel of 2000 (note 1) under development except for variable typical application circuits output voltage variable type (with shutdown sw) figure 1. typical application circuit output voltage variable type(with shutdown sw) output voltage fixed type (with shutdown sw) figure 2. typical application circuit output voltage fixed type(with shutdown sw) output voltage fixed type (without shutdown sw) figure 3. typical application circuit output voltage fixed type (without shutdown sw) vcc en gnd fb vo c in vcc r 2 r 1 vcc en gnd vo c out c in vcc c out vcc gnd vo c in vcc c out
datasheet d a t a s h e e t 3/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 pin configuration/pin description with shutdown sw (htsop-j8) figure 4. pin configuration (with shutdown sw) pin no. pin name pin function 1 vo output pin 2 fb / n.c. (note 1) feedback pin (variable output type) no connection (fixed output type) 3 gnd gnd pin 4 n.c. (note 1) no connection (connect to gnd or leave open) 5 en enable pin 6 n.c. (note 1) no connection (connect to gnd or leave open) 7 n.c. (note 1) no connection (connect to gnd or leave open) 8 v cc power supply pin exposed pad gnd substrate(connect to gnd) (note 1) n.c. pin can be open, becaus e it is not connected to the ic. without shutdown sw (to252-3) figure 5. pin description (without shutdown sw) pin no. pin name pin function 1 vcc power supply pin 2 n.c. (note 1) no connection (leave open) 3 vo output pin fin gnd gnd (note 1) n.c.pin can be open since it is not connected inside of ic. fb/n.c. n.c 8 7 6 5 1 2 3 4 vo gnd en n.c n.c vcc 2 htsop-j8 (top view) 13 to252-3 (top view)
datasheet d a t a s h e e t 4/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 with shutdown sw (to252-5) figure 6. pin configuration (with shutdown sw) pin no. pin name pin function 1 en enable pin 2 vcc power supply pin 3 n.c. (note 1) no connection (leave open) 4 vo output pin 5 fb n.c. (note 1) variable pin (variable output type) n.c. pin (fixed output type) fin gnd gnd (note 1) n.c.pin can be open since it is not connected inside of ic. to252-5 (top view) to252-5 (top view) 12 3 4 5
datasheet d a t a s h e e t 5/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 block diagrams htsop-j8 bd00fc0wefj (output voltage variable type) with shutdown sw figure 7. block diagrams bd00fc0wefj (output voltage variable type with shutdown sw) htsop-j8 bdxxfc0wefj (output voltage fixed type) with shutdown sw figure 8. block diagrams bxxfc0wefj (output voltage variable type with shutdown sw) 1 2 ocp vref tsd drive r 4 5 3 en vcc gnd vo fb vref : ocp : tsd : driver : 1 2 ocp vref tsd drive r 4 5 3 en vcc gnd vo n.c. vref : ocp : tsd : driver : bandgap reference over current protection circuit thermal shut down circuit power transistor driver bandgap reference over current protection circuit thermal shut down circuit power transistor driver
datasheet d a t a s h e e t 6/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 to252-3 bdxxfc0fp (output voltage fixed type) without shutdown sw figure 9. block diagrams bdxxfc0fp (output voltage fixed type, without shutdown sw) fin 1 2 ocp vref tsd drive r 3 gnd vcc n . c. vo : : thermal shut down circuit : power transistor driver vref ocp tsd drive r : bandgap reference over current protection circuit
datasheet d a t a s h e e t 7/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 to252-5 bd00fc0wfp (output voltage variable type) with shutdown sw figure 10. block diagram bd00fc0wfp (output voltage variable type, with shutdown sw) to252-5 bdxxfc0wfp (output voltage fixed type) with shutdown sw figure 11. block diagram bdxxfc0wfp (output voltage fixed type, with shutdown sw) fin 1 2 ocp vref tsd drive r 4 5 3 gnd en vcc n.c. vo fb fin 1 2 ocp vref tsd drive r 4 5 3 gnd en vcc n.c. vo n.c. : : thermal shut down circuit : power transistor driver vref ocp tsd drive r : bandgap reference over current protection circuit : : thermal shut down circuit : power transistor driver vref ocp tsd drive r : bandgap reference over current protection circuit
datasheet d a t a s h e e t 8/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta= 25 ) parameter symbol ratings unit supply voltage * 1 vcc -0.3 to +35.0 v en voltage *2 v en -0.3 to +35.0 v operating temperature range ta -25 to +85 storage temperature range tstg -55 to +150 maximum junction temperature tjmax 150 * 1 do not exceed tjmax. * 2 power supply (vcc) and en pin startup sequence does not matter provided they are operated within the power supply voltage ran ge. operating conditions (-25 Q ta Q +85 ) parameter symbol min max unit supply voltage (v o R 3.0v) vcc v o +1 26.5 v supply voltage (v o <3.0v) vcc 4.0 26.5 v startup voltage (i o =0ma) vcc - 3.8 v en voltage (with shutdown sw) v en 0 26.5 v output current i o 0 1.0 a output voltage * 3 (bd00fc0) v o 1.0 15.0 v * 3 please refer to notes when using bd00fc0 at output voltage of 1.0v to 3.0v. electrical characteristics unless otherwise specified, ta=25c, vcc=13.5v, i o =0ma, v en =5.0v the resistor between fb and out =56.7k ? , fb and gnd =10k ? (bd00fc0) parameter symbol guaranteed limit unit conditions min typ max circuit current at shutdown mode i sd - 0 5 a circuit current icc - 0.5 2.5 ma output reference voltage (bd00fc0) v fb 0.742 0.750 0.758 v i o =50ma output voltage (bd30/33/50fc0) v o v o 0.99 v o v o 1.01 v i o =200ma output voltage (bd60/70/80/90/j0/j2/j5fc0) v o v o 0.99 v o v o 1.01 v i o =500ma *4 minimum dropout voltage ? vd - 0.4 0.7 v vcc=4.0v i o =500ma * minimum dropout voltage (bd00/50/60/70/80/ 90/j0/j2/j5fc0) ? vd - 0.3 0.5 v vcc= v o 0.95, i o =500ma line regulation reg.i - 20 80 mv vcc=v o +1.0v 26.5v load regulation reg.i o - v o 0.010 v o 0.020 v i o =5ma 1a *4 en high voltage (with shutdown sw) v en (high) 2.0 - - v active mode en low voltage (with shutdown sw) v en (low) - - 0.8 v off mode en bias current i en - 25 50 a * 4 in case of j0, j2 and j5, vcc=vo+4.5v * 5 in case of vo R 4.0v
datasheet d a t a s h e e t 9/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 thermal resistance parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p (note 4) htsop-j8 junction to ambient ja 206.4 45.2 c/w junction to top characterization parameter (note 2) jt 21 13 c/w to252-5 / to252-3 junction to ambient ja 115.3 20.8 c/w junction to top characterization parameter (note 2) jt 14 3 c/w (note 1)based on jesd51-2a(still-air) (note 2)the thermal characterization parameter to report the diff erence between junction temperature and the temperature at the top center of the outside surface of the component package. (note 3)using a pcb board based on jesd51-3. layer number of measurement board material board size single fr-4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m (note 4)using a pcb board based on jesd51-5, 7. layer number of measurement board material board size thermal via (note 5) pitch diameter 4 layers fr-4 114.3mm x 76.2mm x 1.6mmt 1.20mm 0.30mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m (note 5) this thermal via connects with the copper pattern of all layers
datasheet d a t a s h e e t 10/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd00fc0 series (5.0 v output setting) unless otherwise specified, ta=25c, vcc=13.5v, v en =5.0v, i o =0ma, v o =5.0v (the resistor between fb and vo =56.7k ? , fb and gnd =10k ? ) 0 3 6 9 12 15 18 0 2 4 6 8 101214161820222426 shutdown current:i sd [ a] supply voltage:vcc [v] 0.0 0.2 0.4 0.6 0.8 1.0 02468101214161820222426 circuit current:icc+i feedback_r [ma] supply voltage:vcc [v] figure 12. circuit current (i feedback_r P 75a) figure 13. shutdown current figure 14. line regulation (i o =0ma) figure 15. line regulation (i o =500ma) 0 1 2 3 4 5 6 02468101214161820222426 output voltage:v o [v] supply voltage:vcc [v] 0 1 2 3 4 5 6 0 2 4 6 8 101214161820222426 output voltage:v o [v] supply voltage:vcc [v]
datasheet d a t a s h e e t 11/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage:v o [v] output current:i o [ma] 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : ? vd[mv] output current:i o [ma] figure 16. load regulation figure 17. dropout voltage (vcc=4.75v) (l o =0ma 1000ma) figure 18. ripple rejection (i o =100ma) figure 19. output voltage temperature characteristic 4. 85 4. 90 4. 95 5. 00 5. 05 5. 10 5. 15 -25-515355575 output voltage: vo [v] ambient temperature: [ ]
datasheet d a t a s h e e t 12/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0 20 40 60 80 100 120 140 160 0 2 4 6 8 101214161820222426 en bias current:i en [ a] enable voltage: v en [v] 0 1 2 3 4 5 6 02468101214161820222426 output voltage:v o [v] enable voltage: v en [v] 0 1 2 3 4 5 6 130 140 150 160 170 180 190 output voltage:v o [v] ambient temperature:ta [ ] 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:icc+i feedback_r [ma] output current:i o [ma] figure 22. en voltage vs output voltage figure 23. thermal shutdown circuit characteristic figure 20. circuit current (i o =0ma 1000 ma) (ifeedback_r P 75a) figure 21. en voltage vs en current
datasheet d a t a s h e e t 13/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 measurement setup for reference data bd00fc0 series 5.0v output setting measurement setup for figure 12 measurement setup for figure 13 measurement setup for figure 14 measurement setup for figure 15 measurement setup for figure 16 measurement setup for figure 17 measurement setup for figure 18 measurement setup for figure 19 measurement setup for figure 20 measurement setup for figure 21 measurement setup for figure 22 measurement setup for figure 23 5v vcc en gnd fb vo 1f 1f 56.7k 10k 13.5v ifee dback_r
datasheet d a t a s h e e t 14/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd33fc0 series unless otherwise specified ta = 25c, vcc=13.5v, v en =5.0v, io=0ma 0.0 0.2 0.4 0.6 0.8 1.0 02468101214161820222426 circuit current:icc [ma] supply voltage:vcc [v] 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:i sd [ a] supply voltage:vcc [v] 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] 0 1 2 3 4 5 6 02468101214161820222426 output voltage:vo [v] supply voltage:vcc [v] figure 26. line regulation (io=0ma) figure 27. line regulation (io=500ma) figure 24. circuit current figure 25. shutdown current
datasheet d a t a s h e e t 15/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 200 400 600 800 1000 circuit current:icc [ma] output current:io [ma] 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] figure 29. ripple rejection (lo=100ma) figure 30. output voltage temperature characteristic figure 28. load regulation figure 31. circuit current 3. 22 3. 24 3. 26 3. 28 3. 30 3. 32 3. 34 3. 36 3. 38 -25-515355575 output voltage: vo [v] ambient temperature: [ ]
datasheet d a t a s h e e t 16/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0 1 2 3 4 5 6 130140150160170180190 output voltage:vo [v] ambient temperature:ta [ ] 0 1 2 3 4 5 6 0 2 4 6 8 101214161820222426 output voltage:vo [v] enable voltage: v en [v] 0 20 40 60 80 100 120 140 160 0 2 4 6 8 101214161820222426 en bias current:i en [ a] enablel voltage: v en [v] figure 34. thermal shutdown circuit characteristic figure 32. en voltage vs en current figure 33. en voltage vs output voltage
datasheet d a t a s h e e t 17/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd50fc0 series unless otherwise specified, ta = 25c, vcc=13.5v, v en =5.0v, io=0ma 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 circuit current:icc [ma] supply voltage:vcc [v] figure 35. circuit current figure 38. line regulation (io=500ma) figure 36. shutdown current figure 37. line regulation (io=0ma) 0 3 6 9 12 15 18 02468101214161820222426 shutdown current:i sd [ a] supply voltage:vcc [v]
datasheet d a t a s h e e t 18/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : ? vd [mv] output current:io [ma] 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] figure 40. dropout voltage (vcc=vo0.95v) figure 41. ripple rejection (lo=100ma) figure 39. load regulation figure 42. output voltage temperature characteristic 4.85 4.90 4.95 5.00 5.05 5.10 5.15 -25-5 15355575 output voltage: vo [v] ambient temperature: [ ]
datasheet d a t a s h e e t 19/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:icc [ma] output current:io [ma] 0 1 2 3 4 5 6 02468101214161820222426 output voltage:vo [v] enable voltage: v en [v] 0 1 2 3 4 5 6 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] 0 20 40 60 80 100 120 140 160 0 2 4 6 8 10 12 14 16 18 20 22 24 26 en bias current:i en [ a] enable voltage: v en [v] figure 43. circuit current figure 45. en voltage vs output voltage figure 44. en voltage vs en current figure 46. thermal shutdown circuit characteristic
datasheet d a t a s h e e t 20/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd80fc0 series unless otherwise specified, ta = 25c, vcc=13.5v, v en =5.0v, io=0ma 0 1 2 3 4 5 6 7 8 9 10 02468101214161820222426 output voltage:vo [v] supply voltage:vcc [v] 0 1 2 3 4 5 6 7 8 9 10 02468101214161820222426 output voltage:vo [v] supply voltage:vcc [v] 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 circuit current:icc [ma] supply voltage:vcc [v] 0 3 6 9 12 15 18 0 2 4 6 8 101214161820222426 shutdown current:i sd [ a] supply voltage:vcc [v] figure 48. shutdown current figure 50. line regulation (io=500ma) figure 47. circuit current figure 49. line regulation (io=0ma)
datasheet d a t a s h e e t 21/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0 1 2 3 4 5 6 7 8 9 10 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : ? vd [mv] output current:io [ma] 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] figure 51. load regulation figure 52. dropout voltage (vcc=vo0.95v) figure 53. ripple rejection (lo=100ma) figure 54. output voltage temperature characteristic 7.76 7.81 7.86 7.91 7.96 8.01 8.06 8.11 8.16 8.21 -25-515355575 output voltage: vo [v] ambient temperature: [ ]
datasheet d a t a s h e e t 22/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0 20 40 60 80 100 120 140 160 02468101214161820222426 en bias current:i en [ a] enable voltage: v en [v] 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:icc [ma] output current:io [ma] 0 1 2 3 4 5 6 7 8 9 10 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] enable voltage: v en [v] 0 1 2 3 4 5 6 7 8 9 10 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] figure 55. circuit current figure 56. en voltage vs en current figure 57. en voltage vs output voltage figure 58. thermal shutdown circuit characteristic
datasheet d a t a s h e e t 23/38 bdxxfc0 series tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data bd90fc0 series unless otherwise specified, ta = 25c, vcc=13.5v, v en =5.0v, io=0ma 0.0 0.2 0.4 0.6 0.8 1.0 1.2 02468101214161820222426 circuit current:icc[ma] supply voltage:vcc [v] 0 1 2 3 4 5 6 7 8 9 10 02468101214161820222426 output voltage:vo [v] supply voltage:vcc [v] 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:i sd [ a] supply voltage:vcc [v] 0 1 2 3 4 5 6 7 8 9 10 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] supply voltage:vcc [v] figure 60. shutdown current figure 59. circuit current figure 61. line regulation (io=0ma) figure 62. line regulation (io=500ma)
24/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0 1 2 3 4 5 6 7 8 9 10 0 400 800 1200 1600 2000 2400 output voltage:vo [v] output current:io [ma] 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : ? vd [mv] output current:io [ma] 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] figure 63. load regulation figure 64. dropout voltage (vcc=vo0.95v) figure 65. ripple rejection (io =100ma) figure 66. output voltage temperature characteristic 8.73 8.83 8.93 9.03 9.13 9.23 -25-5 15355575 output voltage: vo [v] ambient temperature: [ ]
25/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 reference data - continued 0 1 2 3 4 5 6 7 8 9 10 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] 0 1 2 3 4 5 6 7 8 9 10 02468101214161820222426 output voltage:vo [v] enable voltage: v en [v] 0 20 40 60 80 100 120 140 160 0 2 4 6 8 101214161820222426 en bias current:i en [ a] enable voltage: v en [v] 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:icc [ma] output current:io [ma] figure 68. en voltage vs en current figure 67. circuit current figure 69. en voltage vs output voltage figure 70. thermal shutdown circuit characteristic
26/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 measurement setup for reference data bdxxfc0 series(output voltage fixedtype) 5v vcc en gnd n.c. vo 1f 13.5v (1.0f) 2.2f measurement setup for figure 24, 35, 47 and 59 measurement setup for figure 25, 36, 48 and 60 measurement setup for figure 26, 37, 49 and 61 measurement setup for figure 27, 38, 50 and 62 measurement setup for figure 28, 39, 51 and 63 measurement setup for figure 40, 52 and 64 measurement setup for figure 29, 41, 53 and 65 measurement setup for figure 30, 42, 54 and 66 measurement setup for figure 31, 43, 55 and 67 measurement setup for figure 32, 44, 56 and 68 measurement setup for figure 33, 45, 57 and 69 measurement setup for figure 34, 46, 58 and 70
27/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 vcc gnd vcc gnd application examples ? applying positive surge to the vcc pin if there is a possibility that surges hig her than 35.0v will be applied to the vcc pin, a zener diode should be placed between the vcc pin and gnd pin, as shown in the figure below. ? applying negative surge to the vcc pin if there is a possibility that negative surges lower than the gnd are applied to the vcc pin, a schottky diode should be place between the vcc pin and gnd pin, as shown in the figure below. ? implementing a protection diode if there is a possibility that a large inductive load is connect ed to the output pin resulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. figure 71. figure 72. figure 73. vo vo
28/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 thermal design htsop-j8 figure 74. to252-3/5 figure 75. ic mounted on rohm standard board based on jedec. board material: fr4 board size 1s 114.3 mm x 76.2 mm x 1.57 mmt 2s2p 114.3 mm x 76.2 mm x 1.6 mmt mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm x 74.2 mm) condition : ja = 206.4 c/w, jt = 21c/w condition : ja = 45.2 c/w, jt = 13c/w ic mounted on rohm standard board based on jedec. board material: fr4 board size 1s 114.3 mm x 76.2 mm x 1.57 mmt 2s2p 114.3 mm x 76.2 mm x 1.6 mmt mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm x 74.2 mm) condition : ja = 115.3 c/w, jt = 14c/w condition : ja = 20.8 c/w, jt = 3c/w when operating at temperature more than ta=25c, please refer to the power dissi pation characteristic curve shown in figure 74 and 75. the ic characteristics are closely related to the temperature at which the ic is used, so it is necessary to operate the ic at temperatures less than the maximu m junction temperature tjmax. figure 74 and 75 show the acceptable power dissipation characte ristic curves of the htsop- j8 and to252-3/5 packages. even when the ambient temperature (ta) is at normal temperature (25c), the chip juncti on temperature (tj) may be quite high so please operate the ic at temperatures le ss than the acceptable power dissipation. the calculation method for power consumption pc(w) is as follows pc=(vcc vo)io+vccicc acceptable loss pd pc solving this for load current io in order to operate within the acceptable loss it is then possible to find the maximum load current iomax with respect to the applied voltage vcc at the time of thermal desig n. calculation example) when to252-3 / to252-5, ta=85c, vcc=13.5v, vo=5.0v io pd vcc icc vcc vo vcc : input voltage vo : output voltage io : load current icc : circuit current io 365.6ma (icc : 0.5ma) io 3.115 13.5icc 8.5 figure 75 ja=20.8 c/w -48.1mw/c 25c = 6w 85c =3.115w 2.8 w 0.6w 0 0.5 1 1.5 2 2.5 3 3.5 0 255075100125150 power dissipation: pd[w] ambient temperature: ta[c] 6w 1.1 w 0 2 4 6 8 0 255075100125150 power dissipation: pd [w] ambient temperature: ta [c]
29/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuit output voltage configuration method (bd00fc0) please connect resistors r 1 and r 2 (which determines the output voltage) as shown in figure 77. please be aware that the offset, due to the cu rrent that flows from the fb terminal, becomes large when resistors with large values are used. resistance values ranging from r 2 =5k ? to 10k ? is recommended. v out setting equation is, v out P v fb (r 1 +r 2 )/r 2 thoroughly check the constant se ttings on the application because circuit current increases depending on connected resistor. resistance value of r 2 is from 5k ? to 10k ? . determine r 1 by adjusting with r 2 . figure 77. vcc terminal en terminal vo terminal bd30/33/50/60 /70/80/90/j0/j2/j5fc0(w) r 1 (k ? ) (typ) r 2 (k ? ) (typ) r 3 (k ? ) (typ) bd30fc0(w) 10 30.3 15 bd33fc0(w) 34 bd50fc0(w) 56.6 bd60fc0(w) 83.5 bd50fc0(w) 61.7 bd80c0a(w) 5 48.3 20 bd90c0a(w) 55 bdj0c0a(w) 5 61.7 15 bdj2c0a(w) 75 bdj5c0a(w) 4 76.1 bd00fc0w vo terminal fb terminal figure 76. ic fb pin v o r 1 r 2 v fb P 0 . 75 v ( typ ) vcc ic vcc vo r 3 r 2 r 1 vcc vo 15k (typ) en 200 k 200 k 1 k fb
30/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. absolute maximum ratings use of the ic in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values ar e expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. 2. electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits, and other conditions. therefore, be sure to check all relevant factors, includi ng transient characteristics. 3. gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. ensure that no pins are at a voltage below the gnd at any time, regardless of transient characteristics. 4. ground wiring pattern when using both small-signal and lar ge-current gnd traces, the two ground tr aces should be routed separately but connected to a single ground potential within the application in order to avoid variat ions in the small-signal ground caused by large currents. also, ensure that the gnd traces of exte rnal components do not cause variations on gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pi ns and the power supply or gnd pins (caused by poor soldering or foreign objects) may result in damage to the ic. 6. operation in strong electromagnetic fields using this product in strong electromagnet ic fields may cause ic malfunction. caut ion should be exercised in applications where strong electromagnetic fields may be present. 7. testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the ev aluation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 8. power dissipation pd using the unit in excess of the rated power dissipation ma y cause deterioration in electrical characteristics including reduced current capability due to the rise of chip temperatur e. the mentioned power dissipation in the absolute maximum rating of this specification, at ht sop-j8 andto252-3/5 package when 114.3mm 76.2mm 1.6mm glass epoxy board is mounted, is the value of when there is no heat dissipation boar d. and in case this exceeds, take the measures like enlarge the size of board; make copper fo il area for heat dissipation big; and use dissipation board and do not exceed the power dissipation. 9. thermal consideration use a thermal design that allows for a suffic ient margin in light of the pd in actual operating conditions. consider pc that does not exceed pd in actual operating conditions. (pd R pc) tjmax : maximum junction temperature=150( ) , ta : peripheral temperature( ) , ja : thermal resistance of package-ambience( /w), pd : package power dissipation (w), pc : power consumption (w), vcc : input voltage, v o : output voltage, i o : load, icc : circut current package power dissipation : pd (w) = (tjmax-ta) / ja power consumption : pc (w) = (vcc-v o )i o +vccicc 10. vcc pin insert a capacitor (v o R 5.0v:capacitor R 1f, 1.0 Q v o 5.0v:capacitor R 2.2f) between the vcc and gnd pins. choose the capacitance according to the line between the power smoot hing circuit and the vcc pin. se lection of the capacitance also depends on the application. verify the application and a llow for sufficient margins in the design. it is recommended to use a capacitor with excellent voltage and temperature characteristics. electrolytic capacitor ceramic capacitor, low esr capacitor ic
31/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 11. output pin in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend a capacitor with a capacitance of more than 1 f(3.0v Q v o Q 15.0v). electrolytic, tantalum and ceramic capacitors can be used. we recommend a capacitor with a capacitance of more than 4.7 f(1.0v Q v o <3.0v). ceramic capacitors can be used. when selecting the capacitor, ensure that the capacitanc e of more than 1 f(3.0v Q v o Q 15.0v) or more than 4.7 f(1.0v Q v o <3.0v) is maintained at the intended applied voltage and temperature range. due to changes in temperature, the capacitance c an fluctuate possibly resulting in oscillation. fo r selection of the capacitor, refer to the cout_esr vs i out data. the stable operation ran ge given in the reference data is based on the standalone ic and resistive load. for actual applications , the stable operating range is influenc ed by the pcb impedance, input supply impedance, and load impedance. t herefore, verification of the fi nal operating environment is needed. when selecting a ceramic type capacitor, we recommend using x5r, x7r, or better, with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load curr ent, select the capacitance in accordance with verifying that the actual application meets the required specification. operation note 11 measurement circuit (bd00fc0w) 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) cout_esr(? unstable operating region stable operating region cin vs cout 3.0v vo 15.0v (reference data) cout_esr vs io 3.0v vo 15.0v (reference data) 4.0v vcc 26.5v 3.0v v o 15.0v -25 ta +85 5k ? r 2 10k ? (bd00fc0w) cin=2.2f cin 100f 1f cout 100f 4.0v vcc 26.5v 3.0v v o 15.0v -25 ta +85 0a i o 1a 5k ? r 2 10k ? (bd00fc0w) 1 10 100 110100 cout(f) cin f stable operating region 6.0v vcc 26.5v 5.0v v o 15.0v -25 ta +85 0a i o 1a 5k ? r 2 10k ? (bd00fc0w) 1 10 100 110100 cout f cin f stable operating region 2.2 u ns t a bl e o p eratin g re g ion i o ( ma ) 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) cout_esr(? stable operating region unstable operating region 0.5 4.0v vcc 26.5v 1.0v vo < 1.5v -25c ta +85c 5k ? r 1 10k ? (bd00fc0w) 2.2f cin 100f 4.7f cout 100f 4.0v vcc 26.5v 1.0v vo < 3.0v -25c ta +85c 0a io 1a 5k ? r 1 10k ? (bd00fc0w) 4.0v vcc 26.5v 1.5v vo < 3.0v -25c ta +85c 5k ? r 1 10k ? (bd00fc0w) 2.2f cin 100f 4.7f cout 100f stable operating region 1 10 100 110100 cout f cin f stable operating region unstable operating region 2.2 4.7 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) cout_esr(? stable operating region unstable operating region cout_esr vs io 1.0v vo < 3.0v (reference data) cin vs cout 1.0v vo < 3.0v (reference data) vcc en gnd fb vo v en (5.0v) r 2 cin (1f or higher) cout (1f or higher) esr (0.001 or higher) io (rout) r 1 (5k to 10k ) v cc (4.0v to 26.5v)
32/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operation note 11 measurement circuit (bd00fc0w) 12. en pin do not make the voltage level of the chip?s enable pin at floating level or in between v en (high) and v en (low). otherwise, the output voltage would be unstable or indefinite. 13. for a steep change of the vcc voltage because mosfet for output transistor is used when an input voltage change is ve ry steep, it may evoke large current. when selecting the value of external circuit constants, pl ease make sure that the operat ion on the actual application takes these conditions into account. 14. for infinitesimal fluctuat ions of output voltage. for applications that have infinitesimal fluc tuations of the output voltage caused by some factors (e.g. disturbance noise, input voltage fluctuations, load fluctuat ions, etc.), please take enough measures to avoid some influence (e.g. insert a filter, etc.). 15. over current protection circuit (ocp) the ic incorporates an integrated over-cu rrent protection circuit that operates in accordance with the rated output capacity. this circuit serves to protect the ic from damage wh en the load becomes shorted. it is also designed to limit output current (without latching) in the ev ent of a large and instantaneous current flow from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications charac terized by the continuous or transitive operation of the protection circuits. 16. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn the ic off, completely, in the event of thermal overload. it is not designed to pr otect the ic from damage or guarantee its operation. ic?s should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) cout_esr(? unstable operating region stable operating region 4.0v vcc 26.5v 1.0v vo < 3.0v (cout and ceramic capacitor 10f is connected in parallel.) -25c ta +85c 5k ? r 1 10k ? (bd00fc0w) 2.2f cin 100f 1f cout 100f 4.0v vcc 26.5v 1.0v vo < 3.0v (cout and ceramic capacitor 10f is connected in parallel.) -25c ta +85c 0a io 1a 5k ? r 1 10k ? (bd00fc0w) cout_esr vs io 1.0v vo < 3.0v cout and ceramic capacitor 10f is connected in parallel. (reference data) cin vs cout 1.0v vo < 3.0v cout and ceramic capacitor 10f is connected in parallel. (reference data) vcc en gnd fb vo cin (1f or higher) v en (5.0v) v cc (4.0v to 26.5v) r 1 (5k to 10k ) r 2 output load io(rout) cout (1f or higher) esr (0.001 or higher) 10f 1 10 100 110100 cout f cin f stable operating region 2.2 unstable operating region
33/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 17. in some applications, the vcc and the vo potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, the accumulated charge in the output pin capacitor flow backward from the vo to the vcc when the vcc shorts to the gnd. use a capacitor with a capacitance with less than 1000 f for reducing the damage. we also recommend using reverse polarity diodes in series between the vcc and the gnd or a bypass diode between the vo and the vcc. 18. regarding input pins of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent el ements in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, a nd the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. example of monolithic ic structure
34/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 physical dimension tape and reel information s package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
35/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 package name to252-3
36/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 package name to252-5
37/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 marking diagram output voltage[v] part number marking 3.3 33fc0 5.0 50fc0 output voltage[v] part number marking variable 00fc0w 3.0 30fc0w 3.3 33fc0w 5.0 50fc0w 6.0 60fc0w 7.0 70fc0w 8.0 80fc0w 9.0 90fc0w 10.0 j0fc0w 12.0 j2fc0w 15.0 j5fc0w output voltage[v] part number marking variable 00fc0w 3.0 30fc0w 3.3 33fc0w 5.0 50fc0w 6.0 60fc0w 7.0 70fc0w 8.0 80fc0w 9.0 90fc0w 10.0 j0fc0w 12.0 j2fc0w 15.0 j5fc0w htsop-j8 (top view) xxfc0w part number marking lot number 1pin mark to252-3 to252-3 (top view) part number marking lot number to252-5 to252-5 (top view) part number marking lot number htsop-j8 1pin 1pin
38/38 bdxxfc0 series datasheet d a t a s h e e t tsz02201-0g2g0a600040-1-2 ? 2016 rohm co., ltd. all rights reserved. 16.may.2016 rev.004 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 27.aug.2013 001 new release 20.oct. 2015 002 add bdxxfc0fp and bdxxfc0wfp change pin name out -> vo 02.dec. 2015 003 p2 lineup modified 16.may. 2016 004 the document control num ber:tsz02201-0gag0a600040-1-2 -> tsz02201-0g2g0a600040-1-2 p8 power dissipation deleted p8 notes added in electrical characteristics p9 copper pattern area modified misentry modified in whole page
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd50fc0fp package to252-3 unit quantity 2000 minimum package quantity 2000 packing type taping constitution materials list inquiry rohs yes bd50fc0fp - web page

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